01Lithography (minimum line width 0.35um)

02Metal sputtering（Ti、Al、TiN、Cu、Au），Metal evaporation（Ti、Al、Ni、Pt、Mo、Ta、Ag、Co、Cr ,etc.）

03Etch GaN, Si, SiO2, Si3N4, Al, TiN, Ni, Cr, Pt, etc.

04Thin film PECVD deposition of SiO2, Si3N4, ALD deposition of Al2O3, AlN, LPCVD growth of polysilicon, Si3N4 and thermal oxygen deposition, oxidation diffusion, etc.

05Ion implantation of N, B, P, BF2, As, Ar

06TSV process

07Grinding disc scribing and testing, etc.